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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOT MATRIX LED DISPLAY(2.0Inch)
Pb
Lead-Free Parts
LMD5721/2ASR9UG-XX-PF
DATA SHEET
DOC. NO REV. DATE
: QW0905- LMD5721/2ASR9UG-XX-PF :A : 30 - May - 2007
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD5721/2ASR9UG-XX-PF Page 1/9
Package Dimensions
7.62X4=30.48(1.2")
8.6(0.339")
7.62X6= 45.72 (1.8")
53.2 (2.094")
38.35 (1.51")
5.0(0.197")
38.5(1.516")
LMD5721/2ASR9UG-XX-PF LIGITEK
0.51 TYP
6.00.5
2.54X8=20.32 (0.8")
PIN NO.1
Note : 1.All dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD5721/2ASR9UG-XX-PF Page 2/9
Internal Circuit Diagram
LMD5721ASR9UG-XX-PF
COLUMN ROW PIN 1 16 18 1 13 2 24 3 13 7 4 12 11 5 10
2
15
3
17
4
14
5
8
6
5
7
6
LMD5722ASR9UG-XX-PF
COLUMN ROW PIN 1 16 18 1 13 2 24 3 13 7 4 12 11 5 10
2
15
3
17
4
14
5
8
6
5
7
6
RED
GREEN
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD5721/2ASR9UG-XX-PF Page 3/9
Electrical Connection
PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
LMD5721ASR9UG-XX-PF Cathode Column 1 (Green) Cathode Column 2 (Green) Cathode Column 2 (Red ) Cathode Column 3 (Red ) Anode Row 6 Anode Row 7 Cathode Column 4 (Red) Anode Row 5 No Connect Cathode Column 5 (Green) Cathode Column 5 (Red) Cathode Column 4 (Green) Cathode Column 3 (Green) Anode Row 4 Anode Row 2 Anode Row 1 Anode Row 3 Cathode Column 1 (Red)
PIN NO. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
LMD5722ASR9UG-XX-PF Anode Column 1 (Green) Anode Column 2 (Green) Anode Column 2 (Red ) Anode Column 3 (Red ) Cathode Row 6 Cathode Row 7 Anode Column 4 (Red) Cathode Row 5 No Connect Anode Column 5 (Green) Anode Column 5 (Red) Anode Column 4 (Green) Anode Column 3 (Green) Cathode Row 4 Cathode Row 2 Cathode Row 1 Cathode Row 3 Anode Column 1 (Red)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD5721/2ASR9UG-XX-PF Page 4/9
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol SR Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Electrostatic Discharge( * ) Operating Temperature Storage Temperature IF IFP PD Ir ESD Topr Tstg ---25 ~ +85 -25 ~ +85 30 100 100 10 2000 9UG 30 60 75 mA mA mW UNIT
A V
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260
Static Electricity or power surge will the Use of anti-electrosatic * glove is recommended when handingdamageLED.LED.devices, a conductive wrist band or must be properly these All equipment and machinery grounded.
Part Selection And Application Information(Ratings at 25)
Electrical
PART NO
common P D Vf(v) Iv(mcd) IV-M cathode (nm) (nm) (nm) Min. Typ. Max. Min. Typ. Material Emitted or anode
CHIP
GaAlAs
Red Green Red Green
LMD5721ASR9UG-XX-PF
AlGaInP GaAlAs
LMD5722ASR9UG-XX-PF
Common Cathode Common Anode
660 --660 ---
--574 --574
20 20 20 20
1.5 1.7 1.5 1.7
1.8 2.1 1.8 2.1
2.4 2.6 2.4 2.6
5.0 6.1 5.0 6.1
8.5 10.5 8.5 10.5 2:1
AlGaInP
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD5721/2ASR9UG-XX-PF Page 5/9
Test Condition For Each Parameter
Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Peak Wavelength Dominant Wavelength Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio
Symbol Vf Iv
Unit volt mcd nm nm nm
Test Condition If=20mA If=10mA If=20mA If=20mA If=20mA Vr=5V
p D
Ir IV-M
A
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD5721/2ASR9UG-XX-PF Page 6/9
Typical Electro-Optical Characteristics Curve
SR CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Forward Current(mA)
100
Relative Intensity Normalize @20mA
2.5 2.0 1.5 1.0 0.5 0.0
10 1.0
0.1 1.0 2.0 3.0 4.0 5.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
Forward Voltage@20mA Normalize @25
1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100
Relative Intensity@20mA Normalize @25
1.2
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 600 650 700 750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD5721/2ASR9UG-XX-PF Page7/9
Typical Electro-Optical Characteristics Curve
9UG CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
2.5 2.0 1.5 1.0 0.5 0 1.0 10 100 1000
10
1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
Relative Intensity @20mA Normalize @25
-40 -20 0 20 40 60 80 100
Forward Voltage@20mA Normaliz @25
1.2
3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 100
1.1 1.0 0.9
0.8
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity @20mA
1.0
0.5
0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD5721/2ASR9UG-XX-PF Page 8/9
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One time only) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 C 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 C
Temp(C) 260 C3sec Max
260
5 /sec max
120
2 /sec max Preheat 60 Seconds Max
25 0 0
50
100
150
Time(sec)
Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LMD5721/2ASR9UG-XX-PF Page 9/9
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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